Established in 1972 and written for engineers and managers in the computer, communications, and other electronics-based industries, EE Times offers engineering management news, analysis and opinion on technology and business developments in the electronics industry. Technology coverage includes a wide variety of industry hardware and software. Security/encryption is also covered from a coding standpoint, including SSL and TLS. EE Times covers strategic businesses, product lines, chip designs and techno/business trends that are shaping and remaking the semiconductor manufacturing industry. Editorial coverage in these areas include stories from the US, Japan, Europe and Asia-Pacific. Strives to illustrate the evolution and complementary nature of news reporting in print and online with print articles coinciding with the editorial content found on the Web site. Links at the end of the print articles point to sources on the Internet where readers can find more information on the topic being discussed. Regular departments include News Analysis, Business, Design and Products. The outlet offers RSS (Really Simple Syndication).

Background and Format: Founded in October 2008, TMT Finance provides specialist news, research, networking and knowledge sharing events. As well as the portal, TMT products also include a newsletter, conferences, award ceremonies and market reports. They provide insight and intelligence on new opportunities in growth markets in the telecom, media and technology sectors. Audience and Readership: Senior executives from the telecom, finance and professional advisory community globally. Monthly Unique Users: The publisher does not disclose the monthly unique user figure. Ad rates: Information on ad rates are not disclosed. Other information: The TMT Finance News Newsletter is now published weekly. It used to be sent out fortnightly.

Established in 1997 serving the design, engineering manufacture, test and application of chip-scale electronics, research and testing, and other allied industries. Publishes information on the packaging and testing of advanced integrated circuits. Features include the design, materials, processes and applications employed in the semiconductor and optoelectronic packaging industries.

Background and Format: Launched in 1995, Compound Semiconductor is published by Angel Business Communications Ltd monthly and is aimed at professionals who work in the compound semiconductor industry. Covers company & industry news & technology features as well as discussions of laboratories and high power electronics. There is also an edition for China. The media pack is available from: data.angel.digital/pdf/CS_Media_Pack_2019.pdf Circulation: Source: Publisher

Targets professionals in the manufacturing industry. Aims to present issues related to the manufacturing trade in the target region. Provides information on personnel changes, government and private sector contracts and how they are awarded, new developments in manufacturing, new machinery and accessories, product information, case studies, company announcements, innovative uses for products and product reviews. Also highlights environmental issues related to manufacturing as well as technological advances which affect the industry worldwide.